发明名称 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition having high definition and capable of forming a resin pattern in which occurrence of a crack is suppressed, and to provide a cured product prepared by curing such a curable resin composition. <P>SOLUTION: The curable resin composition includes (A) a polyfunctional epoxy resin which is solid at ordinary temperatures, (B) a cationic initiator, and (C) a (meth)acrylic monomer. The (C) (meth)acrylic monomer has two or more ethylenic unsaturated bonds coupled with a linear alkylene chain which may contain an oxygen atom. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011111588(A) 申请公布日期 2011.06.09
申请号 JP20090271578 申请日期 2009.11.30
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SENZAKI TAKAHIRO
分类号 C08G59/32;C08F2/44;C08F283/10 主分类号 C08G59/32
代理机构 代理人
主权项
地址