| 发明名称 |
COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition for forming a substrate, having excellent thermal and mechanical properties, and a prepreg and a substrate using the composition. <P>SOLUTION: The composition for forming the substrate includes a compound prepared by polymerizing a liquid crystal thermosetting oligomer having one or more soluble structural units in a main chain thereof and having a thermosetting group at one or more of two ends of the main chain thereof with a fluorine compound having a functional group which can react with the main chain of the liquid crystal thermosetting oligomer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011111619(A) |
申请公布日期 |
2011.06.09 |
| 申请号 |
JP20100012408 |
申请日期 |
2010.01.22 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
YUN GEUN HEE;OH JUN ROK;LEE KEUN YONG |
| 分类号 |
C08G85/00;C08G65/26;C08J5/24;C08K3/00;C08L101/00;H05K1/03 |
主分类号 |
C08G85/00 |
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