| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing manufacturing cost. SOLUTION: The electronic device includes: a housing including a shield layer 31 on the inner surface and provided with openings 29; a housed component housed in the housing; a module including a first conduction part 33 arranged in the outside of the housing and electrically connected to the housed component, and a second conduction part 32 different from the first conduction part 33; and connection parts 28 each including a contact part 34 electrically connected to the shield layer 31 from the opening 29 and setting the potential of the shield layer 31 equal to that of the second conduction part 32 by being brought into contact with the second conduction part 32, and an elastic support part 35 extending from the vicinity of the opening 29 to support the contact part 34. COPYRIGHT: (C)2011,JPO&INPIT
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