发明名称 |
SOCKET ASSEMBLY WITH A THERMAL MANAGEMENT STRUCTURE |
摘要 |
A socket assembly includes a lighting package and a socket housing having a receptacle that removably receives the lighting package. A thermal management structure is coupled to the socket housing and is positioned at the receptacle in thermal engagement with the lighting package. The thermal management structure is configured to engage a heat sink to dissipate heat from the lighting package to the heat sink. Optionally, at least one of the socket housing and the thermal management structure may have mounting features configured to mount the socket assembly to a heat sink, where the lighting package is removable from the receptacle while the socket assembly remains mounted to the heat sink. The thermal management structure may be coupled to the socket housing such that the thermal management structure and the socket housing are coupled to a heat sink as a unit.
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申请公布号 |
US2011136374(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20090634542 |
申请日期 |
2009.12.09 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
MOSTOLLER MATTHEW EDWARD;DAILY CHRISTOPHER GEORGE;GINGRICH, III CHARLES RAYMOND;WEBER RONALD MARTIN |
分类号 |
H01R13/00 |
主分类号 |
H01R13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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