| 发明名称 |
METHOD AND APPARATUS FOR POLISHING A SUBSTRATE HAVING A GRINDED BACK SURFACE |
| 摘要 |
A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.
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| 申请公布号 |
US2011136411(A1) |
申请公布日期 |
2011.06.09 |
| 申请号 |
US20100956381 |
申请日期 |
2010.11.30 |
| 申请人 |
NAKANISHI MASAYUKI;ONOZAWA MASUNOBU;SEKI MASAYA |
发明人 |
NAKANISHI MASAYUKI;ONOZAWA MASUNOBU;SEKI MASAYA |
| 分类号 |
B24B1/00;B24B9/00;B24B21/00;B24B21/02;B24B41/06;H01L21/304 |
主分类号 |
B24B1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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