SEMICONDUCTOR CHIP WITH BACKSIDE METALLIZATION AND ARRANGEMENT OF SAID CHIP ON A CARRIER

摘要

An electronic device or circuit (4) at the front side (2) of a substrate (1) of semiconductor material with terminals (5) and a wiring electrically connected with the terminals is connected with a structured backside metallization (7) on the rear side. An interconnect (8) through the substrate is electrically connected with the backside metallization, and the interconnect and the backside metallization form part of the wiring. The chip (11) can be arranged on a carrier (10) comprising contact areas (15), which can be connected with the backside metallization or the terminals directly or via bond wires.