| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate holding device which adopts a pin chuck and planarly corrects a warped wafer so as to achieve normal adsorption. <P>SOLUTION: The substrate holding device 20 has a chuck body 21 including: bottoms 22, 23 with a plurality of pin shape projections 6 formed thereon; a partitioning part 7 formed in the bottom 23 so as to be positioned in the outer periphery of the pin shape projections 6; and a vacuum hole 10 penetrated close to the center of the bottom 22 for vacuum exhaust. The device holds the substrate 2 by adsorption by performing the vacuum exhaust in regions 24, 25 which are formed between the substrate 2 and the bottoms 22, 23 when placing the substrate 2 on a placement surface including the pin shape projections 6. The bottoms 22, 23 include a center region and an outer peripheral region arranged in the periphery of the center region, where the depth of the center region is larger than that of the outer peripheral region. <P>COPYRIGHT: (C)2011,JPO&INPIT |
