| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition with excellent low-temperature curability and storage stability, and a circuit connecting material using the same, and to provide a connector with excellent connection reliability, a connection method of a circuit member, and a semiconductor device. SOLUTION: The adhesive composition includes (A) an alicyclic epoxy compound, (B) a cation generator, and (C1) a second cationically polymerizable compound having cationic polymerizability lower than that of the alicyclic epoxy compound. COPYRIGHT: (C)2011,JPO&INPIT |
