| 摘要 |
The heat-release properties of semiconductor device are to be improved and the reliability thereof is to be improved. The semiconductor device has a wiring substrate, a heat-releasing plate having a convex part inserted into a through-hole of the wiring substrate, a semiconductor chip mounted over the convex part of the heat-releasing plate, and a bonding wire coupling an electrode pad of the semiconductor chip with a bonding lead of the wiring substrate, and further has a sealing portion covering a portion of an upper surface of the wiring substrate, a sealing portion covering a portion of a lower surface of the wiring substrate including the semiconductor chip and the bonding wire, and a solder ball placed over a lower surface of the wiring substrate. In manufacturing the semiconductor device, the heat-releasing plate is positioned at the upper surface side of the wiring substrate such that the convex part is positioned in the through-hole, and a groove in the main surface of the convex part is forcibly widened to swage the convex part and to be fixed to the wiring substrate.
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