HEAT RADIATION STRUCTURE FOR IMAGING ELEMENT PACKAGE

摘要

A circuit substrate (13) having a PGA imaging element package (11) mounted thereon is affixed to a metal housing (16) which is a member for radiating heat by way of a heat conducting member (15) such as heat radiating silicone gel. A deformable sheet-shaped heat conducting member (17) formed from a graphite sheet or the like is affixed in close contact to the planar surface portion in the center of the rear surface of the imaging element package (11) using a heat-conducting adhesive agent. The sheet-shaped heat conducting member (17) is arranged so as to protrude at both sides from the center of the rear surface of the imaging element package (11), extend over the imaging element package (11) and the housing (16), and bypass the outer side of the circuit substrate (13). The tip end portion of the sheet-shaped heat conducting member (17) is affixed in close contact to a planar surface of the housing (16) by means of a heat conducting adhesive agent or an adhesive gel.