| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamideimide-based heat resistant resin composition with excellent close adhesion (in the initial value and after thermal deterioration) and flexibility, a coating having the heat resistant resin composition as a coated film component, and an enamel wire excellent in close adhesion and flexibility by using the same. <P>SOLUTION: The heat resistant resin composition is obtained by including a tetrazole compound in a polyamideimide resin obtained from a reaction of a mixture of (a) a trivalent or higher valent polycarboxylic acid having an acid anhydride group or a derivative thereof, (b) an aliphatic polycarbonate diol represented by general formula (I) (wherein a plurality of Rs are each independently a 1-12C alkylene group and m is an integer of 1-20), and (c) an aromatic polyisocyanate. The coating and the enamel wire are obtained by using the same. <P>COPYRIGHT: (C)2011,JPO&INPIT |
