| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board wherein the lower surface of a circuit board to which a hybrid integrated circuit is built into the upper surface is covered with a thin sealing resin. <P>SOLUTION: The circuit board 12 comprising a circuit element such as a semiconductor element or the like is stored within a metal die 30 and two resin sheets 42A, 42B are provided between the circuit board 12 and internal wall lower surface of the metal die 30. The lower surface of the circuit board 12 can be covered with a thin sealing resin through the use of the melted resin sheet 42 by heating the metal die 30 up to a high temperature under this condition and injecting the sealing resin liquid from a gate 44. Moreover, the individual resin sheet can be reduced in size in plane view and damage during transportation of the resin sheet can be suppressed by utilizing the two resin sheets 42A and 42B. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
