| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board which suppresses occurrence of delamination, and excelling in an insulation property between wires adjacent to each other, and to provide a multilayer wiring board. SOLUTION: The method of manufacturing a multilayer wiring board includes: preparing a ceramic green sheet 4 containing ceramic powder having an average particle size of 1-10μm and an organic binder; forming grooves 41 formed by using second projections 21 by pressing a second die 2 against the upper surface of the ceramic green sheet 4; putting and forming ceramic slurry 5 containing ceramic powder having an average particle size of 0.1-0.5μm and a hot-melt resin at least on the inner walls of the grooves 41 on the upper surface of the ceramic green sheet 4; and pressing a first die 1 heated to soften the hot-melt resin against the upper surface of the green sheet 4 to form grooves 51 of wiring shapes each having side faces and a bottom face formed of the ceramic slurry 5 inside the grooves by using the second projections 21. COPYRIGHT: (C)2011,JPO&INPIT |
