| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor device, capable of restraining burrs on an FPC (flexible printed circuit) board when resin-sealing a semiconductor device, with a flexible board being pulled out to the outside. SOLUTION: A portion except a mounting surface of the flexible board is resin sealed by a second sealing resin indicating high fluidity, while contacting a fluidity-restrained first sealing resin to a pulled-out section of the flexible board. COPYRIGHT: (C)2011,JPO&INPIT
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