发明名称 MOLD CLAMPING DEVICE AND METHOD FOR CONTROLLING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping device which can make a time loss during a time period from the engagement between the half nut and engagement part of the half nut mechanism of the mold clamping device until mold clamping by operating a mold clamping cylinder, extremely small for coping with a problem which occurs when the molding cycle of, for example, a mold temperature change is repeated and a method for controlling the mold clamping device. SOLUTION: The half nut mechanism 19 of the mold clamping device 12 is provided engageably, while the half nut 20 and the engagement part 21 has a clearance formed therebetween. After the half nut 20 is engaged with the engagement part 21, on the basis of free running distances T, T1, and T2 before the mold clamping surface 20b of the half nut 20 and the mold clamping surface 21b of the engagement part 21 are brought into contact by the operation of a mold clamping mechanism 22, the half nut mechanism 19, although it is a mold clamping side member, is moved/controlled to an engagement starting position Ln+1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011110700(A) 申请公布日期 2011.06.09
申请号 JP20090265813 申请日期 2009.11.23
申请人 MEIKI CO LTD 发明人 KAKO MINETOSHI
分类号 B29C33/22;B29C45/64;B29C45/80 主分类号 B29C33/22
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