| 摘要 |
Disclosed is a substrate structure for light-emitting diode (LED), including an upper layer substrate, a flexible printed circuit, a lower layer substrate, and an isolation substance. The upper layer substrate has forming a conductor pattern to provide a bonding zone and a plurality of electrode zones. The flexible printed circuit is bonded under the upper layer substrate. The lower layer substrate is bonded under the flexible printed circuit and has forming conductor lines. The isolation substance is coated on the top surface of the upper layer substrate and the bottom surface of the lower layer substrate. As such, a substrate structure comprised of upper and lower layers made of the upper-layer and lower-layer substrates interposing a core made of the flexible printed circuit is formed.
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