| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such the problem that mounting strength in leads can not be easily improved in the conventional semiconductor device since a package is more microfabricated. <P>SOLUTION: A semiconductor device has parts of leads 4 exposed from the rear surface 5 of a resin package 2 and also has grooves 8 arranged in the leads 4. Each of the grooves 8 is arranged in a region inside the outer peripheral end of a lead 4, and a flat surface 9 is arranged at the periphery of the groove 8. In this structure, the inner side surface of the groove 8 is used as a mounting region for the lead 4 to improve mounting strength of the lead 4. Further, infiltration of a resin is restricted by the flat surface 9 of the lead 4 to greatly reduce formation of resin burrs. <P>COPYRIGHT: (C)2011,JPO&INPIT |
