| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical device capable of providing an optical device having a predetermined thickness without damaging a device layer. SOLUTION: The method of manufacturing an optical device for dividing an optical device wafer into individual optical devices along a street includes: an alteration layer formation process of positioning a light collection point P in a substrate 20 to irradiate a region corresponding to the street from the back side to form an alteration layer 210 in the substrate 20; an optical device wafer formation process of laminating an optical device layer on the surface of the substrate 20 to form optical devices in a plurality of regions partitioned by a plurality of streets formed in a lattice-like form, and thereby forming the optical device wafer; a protective member sticking process of sticking a protective member to a surface of the optical device wafer; a back face grinding process of grinding the back face of the optical device wafer to be formed in a predetermined thickness; and a wafer breaking process of breaking the optical device wafer along the streets by applying external force to the optical device wafer. COPYRIGHT: (C)2011,JPO&INPIT |
