| 摘要 |
PROBLEM TO BE SOLVED: To suppress unwanted bonding of an adhesive which has oozed out, in pasting of a bonding sheet having a split permitting cut formed thereon. SOLUTION: The sheet pasting apparatus includes a supply means for unreeling an original sheet on which bonding sheets S are temporarily attached with a predetermined interval on a strip-like peeling sheet; a peeling plate for peeling the bonding sheets S by folding back the peeling sheet, the midway of unreeling by the supplying means; and a pressing means 16 for pressing the peeled bonding sheet S to a wafer W to paste the sheet. Each bonding sheet S is constituted of a base material sheet BS and an adhesive layer AD, formed on one surface of the base material sheet BS. The split permitting cut C is formed on the base material sheet BS or on the base material sheet BS and the adhesive layer AD, and a noncontact portion 31 is formed on a press roller 30 of the pressing means 16, and the noncontact portion 31 is formed in a region corresponding to a position where the split permitting cut C is formed, when the bonding sheet S is pressed. COPYRIGHT: (C)2011,JPO&INPIT |
