| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a build-up wiring board having a narrow gap pattern that reduces fault occurrence ratio by separating a dry film resist without a failure. SOLUTION: At a step of separating the dry film resists in the process of manufacturing a buildup wiring substrate according to a semi-additive method, an electromagnetic induction coil for enclosing a transfer portion of a buildup wiring substrate 51 is formed to ensure that an insulating-coated conductor 61 for flowing high-frequency current reciprocates for many times between cores of an upper transfer roll 71 and a lower transfer roll 72. After a separation fluid is sprayed into the buildup wiring substrate, the buildup wiring substrate is transferred into the electromagnetic induction coil to which high-frequency current is applied, thus vibrating a copper wiring layer and an electrolytic copper plating layer, and facilitating the separation of the dry film resist. COPYRIGHT: (C)2011,JPO&INPIT |
