| 摘要 |
PURPOSE: A light emitting device, a manufacturing method thereof, a light emitting device package and a lighting system including the same are provided to prevent electrostatic damage by forming a capacitor in an LED chip. CONSTITUTION: A light emitting structure(110) includes a first conductive semiconductor layer(112), an active layer(114), and a second conductive semiconductor layer(116). A first dielectric layer(142) is formed on the upper edge of the light emitting structure. A second dielectric layer(141) is formed on the upper edge of the light emitting structure. A pad electrode(160) is formed on the first dielectric layer. A first electrode(150) is contacted with the upper side of the light emitting structure. |
