| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of failures, in peeling of a bonding sheet. SOLUTION: A sheet-peeling apparatus 10 peels a bonding sheet S pasted on one surface of a wafer W from the wafer W via a peeling tape PT. The bonding sheet S includes a base material sheet and an adhesive layer formed on one surface of the base material sheet. The bonding sheet S has a cut having one end reaching an outer edge of the base material sheet. The sheet-peeling apparatus 10 includes an unreeling means 12 for unreeling the peeling tape PT; a pasting means 14 for pasting the peeling tape PT to the bonding sheet S; and a moving means 15; capable of peeling the bonding sheet S by relatively making the wafer W and the peeling tape PT move. COPYRIGHT: (C)2011,JPO&INPIT |
