发明名称 DUAL PATTERNING METHOD FOR SUBSTRATE USING ATMOSPHERIC PRESSURE PLASMA
摘要 PURPOSE: A dual patterning method of a substrate using atmospheric pressure plasma is provided to simultaneously form a hydrophobic pattern and a hydrophilic pattern on the substrate below several micro meters by selectively discharging atmospheric plasma. CONSTITUTION: A substrate is provided to an atmospheric pressure plasma device including a first electrode and a second electrode(S100). A hydrophobic pattern is formed on the substrate by discharging the atmospheric pressure plasma between the first electrode and the second electrode(S110). The substrate is transferred between the first electrode and the second electrode(S120). A hydrophilic pattern is formed on the substrate by discharging atmospheric pressure plasma between the first electrode and the second electrode(S130).
申请公布号 KR20110061062(A) 申请公布日期 2011.06.09
申请号 KR20090117590 申请日期 2009.12.01
申请人 SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION 发明人 YEOM, GEUN YOUNG;LIM, JONG TAE;PARK, JAE BEOM;KWON, JAE WOOK;OH, JONG SIK
分类号 H01L21/3065;C23C16/04 主分类号 H01L21/3065
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