发明名称 LIQUID KNIFE FOR SUPPLYING A PROCESSING LIQUID ONTO A SUBSTRATE
摘要 PURPOSE: A liquid knife for supplying processing solutions to a substrate is provided to uniformly supply processing solutions to the substrate by dividing a buffer space of the liquid knife by a plurality of partitions. CONSTITUTION: A substrate(10) is transferred in a first horizontal direction by a plurality of transferring rollers(20). A slit type inlet(130) is arranged between a top panel and a bottom panel. A channel type first buffer space(132) is connected to the inlet. A plurality of partitions(140) are arranged to divide the first buffer space into plural parts. A slit type outlet(138) supplies processing solutions from the first buffer space to the substrate.
申请公布号 KR20110061308(A) 申请公布日期 2011.06.09
申请号 KR20090117917 申请日期 2009.12.01
申请人 SEMES CO., LTD. 发明人 LEE, SANG JOON
分类号 H01L21/304 主分类号 H01L21/304
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