| 发明名称 |
EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN |
| 摘要 |
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| 申请公布号 |
EP1785441(B1) |
申请公布日期 |
2011.06.08 |
| 申请号 |
EP20050776808 |
申请日期 |
2005.08.31 |
| 申请人 |
DIC CORPORATION |
发明人 |
OGURA, ICHIRO;TAKAHASHI, YOSHIYUKI;ARITA, KAZUO;MORINAGA, KUNIHIRO;SATOU, YUTAKA |
| 分类号 |
H01L23/31;C08G59/62;C08G61/02;H01L23/29 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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