发明名称 |
THIN FILM RESISTOR HEAD STRUCTURE AND METHOD FOR REDUCING HEAD RESISTIVITY VARIANCE |
摘要 |
<p>A method of making integrated circuit thin film resistor includes forming a first dielectric layer ( 18 B) over a substrate and providing a structure to reduce variation of head resistivity thereof by forming a dummy fill layer ( 9 A) on the first dielectric layer, and forming a second dielectric layer ( 18 D) over the first dummy fill layer. A thin film resistor ( 2 ) is formed on the second dielectric layer ( 18 D). A first inter-level dielectric layer ( 21 A) is formed on the thin film resistor and the second dielectric layer. A first metal layer ( 22 A) is formed on the first inter-level dielectric layer and electrically contacts a portion of the thin film resistor. Preferably, the first dummy fill layer is formed as a repetitive pattern of sections such that the repetitive pattern is symmetrically aligned with respect to multiple edges of the thin-film resistor ( 2 ). Preferably, the first dummy fill layer is formed so as to extend sufficiently far beyond ends of the thin-film resistor to ensure only a negligible amount of systematic resistance error due to misalignment.</p> |
申请公布号 |
EP1872389(A4) |
申请公布日期 |
2011.06.08 |
申请号 |
EP20060750034 |
申请日期 |
2006.04.10 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BEACH, ERIC, W.;STEINMANN, PHILIPP |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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