CARRIER FOR MANUFACTURING WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE USING THE SAME

摘要

PURPOSE: A carrier for manufacturing a wiring substrate and a method for manufacturing a wiring board using the same are provided to laminate an SR layer on upper and lower surfaces of a wiring substrate by forming a protective layer on an upper surface of a supporting layer. CONSTITUTION: An adhesive layer is formed on one surface or double-surfaces of a prepreg. A supporting layer(130) is formed on an upper surface of the adhesive layer. A protective layer(140) is formed on an upper surface of the supporting layer. The adhesive layer(120) is formed with the material which loses the adhesive strength at least the constant temperature. The protective layer is formed with the material which can be selectively etched.