发明名称 |
An integrated circuit package |
摘要 |
A package comprising a first die; a second die; an interface between the first and second die, said interface being configured to transport a plurality of control signals, wherein the number of control signals is greater than a width of said interface, and at least one of said first and second dies comprising configurable grouping means for providing a plurality of groups of control signals whereby a group of signals is transmitted across the interface together. |
申请公布号 |
EP2330514(A1) |
申请公布日期 |
2011.06.08 |
申请号 |
EP20090178183 |
申请日期 |
2009.12.07 |
申请人 |
STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED |
发明人 |
JONES, ANDREW MICHAEL;RYAN, STUART |
分类号 |
G06F13/42;G06F13/38 |
主分类号 |
G06F13/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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