发明名称 FLUID OVERFILL PROBE WITH THERMAL STRESS PREVENTION
摘要 A fluid overfill probe is resistant to failure caused by physical stresses resulting from thermal expansion of probe components. A fluid level detector is connected to circuit components that are mounted on a circuit board located in a housing of the probe. The circuit board is located within a tube that is positioned within, and secured to the housing, and the circuit board is secured to an inner surface of the tube along its edges. The tube has a shape and rigidity sufficient to maintain a gap between the circuit components and the inner surface of the tube such that thermal expansion of probe components result in no physical stress to the circuit components.
申请公布号 EP2329235(A1) 申请公布日期 2011.06.08
申请号 EP20090792930 申请日期 2009.09.24
申请人 SCULLY SIGNAL COMPANY 发明人 TROTTIER, ROBERT, R.
分类号 G01F23/292 主分类号 G01F23/292
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