SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

PURPOSE: A solid imaging device, a manufacturing method thereof, an electronic apparatus are provided to form a protection layer without the increase of processes by simultaneously forming an insulation layer comprising an EDI and the protection layer on the upper side of an insulation layer. CONSTITUTION: A plurality of photo diodes(PD) comprising each pixel are formed in a pixel area(3) of a semiconductor layer(20). A multilayer wiring layer(21) is formed on the surface of the semiconductor layer. A color filter layer(32) and an on chip lens(33) are formed on the area of the semiconductor layer. An alignment mark(27) is formed on an alignment mark forming area(35). An insulation layer(29) is coated on a protection layer(30) on the surface of the semiconductor layer.