| 摘要 |
<p>PURPOSE: A light emitting diode package having a dome type encapsulation layer and a method for fabricating the same are provided to protect a light emitting diode chip by forming a domed passivation layer high according to block of the dispersion of a sealed fluid. CONSTITUTION: In a device, a package substrate(11) includes a peripheral area that surrounds an element area and the element area. Bonding pads(21,22) are formed on the element area of the package substrate. A heat sink(30) is arranged at the bottom of the package substrate. Housing(12) having a cavity is arranged on the peripheral area of the package substrate. A concavo-convex region(50) is formed on the housing. The concavo-convex region includes a plurality of protrusions(51,52,53,54) which surrounds the element area. A light emitting diode chip(40) is arranged at one among bonding pads exposed within the cavity. The domed sealed layer(60) is formed by dotting fluid on the light emitting diode chip.</p> |
