LEADFRAME AND METHOD OF MANUFACTURIG SAME

摘要

PURPOSE: A lead frame and a manufacturing method thereof are provided to improve adhesion of a soldering by forming a swell structure and implementing a flip chip bonding with routability. CONSTITUTION: An insulation groove, a lead unit, and a die pad unit are formed by half etching the upper side of a metal substrate. The upper side of the metal substrate is filled with resin. A support unit(170) is formed on a copper substrate to be separated from the protruded surfaces of the lead unit and the die pad unit. The protruded upper sides of the lead unit and the die pad unit are exposed. An outer lead(190b) and an inner lead are formed by plating the lower side of the metal substrate and the exposed upper side. The inner lead and the die pad unit are shorted by etching the lower side of the metal substrate. The copper substrate is removed.