| 摘要 |
PURPOSE: A semiconductor device is provided to fill a conductive layer in a trench for a pad by forming a plurality of protrusions on a pad unit. CONSTITUTION: A plurality of conductive lines are buried in a substrate. A trench for a pad connects four line type trenches. The trench for the pad includes a plurality of punches. The width(W2) of the line type trench and the space width(W3) between adjacent line type trenches are equal to the width(W4) of the buried conductive lines.
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