PRINTEDE CIRCUIT BOARD MANUFACTURING METHOD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to perform a roll-to-roll process by using atmospheric pressure plasma. CONSTITUTION: A via hole is formed at an insulating layer which includes metal seed layers(120) formed on both sides thereof. The double-sided metal seed layers are electrically connected to each other by plating an inner wall of the via hole. A part of the double-sided metal seed layers is exposed. Double-sided circuit patterns(160) are formed by plating the exposed double-sided metal seed layers and the plated inner wall of the via hole. The double-sided circuit patterns are electrically connected to each other. A photoresist layer(150) is removed.