| 摘要 |
The invention concerns an electronic component package comprising an electronic component (1) having a circuit surface, a block of resin (3) partially surrounding said electronic component, and a multi-layer interconnection (6) in contact with said circuit surface, wherein said multi-layer interconnection (6) is connected to bond-pads having a pitch lower than 50 µm, and said block of resin (3) is made of injection-molding resin. |
