SEMICONDUCTOR DEVICE WITH BURIED BITLIN METHOD FOR MANUFACTURING THE SAMEE

摘要

PURPOSE: A semiconductor device including a buried bit line and a manufacturing method thereof are provided to uniformly form the depth and position of a junction area by using a photosensitive film when a junction area is formed. CONSTITUTION: A first conductive film is formed on a substrate(21). A plurality of buried bit lines are formed by etching a first conductive layer. A first active area(27) is formed between the buried bit lines. A junction area(31) connected to the buried bit line is formed on the first active area. A second active area(32A) separated by a trench is formed on the first active area.