PRINTEDE CIRCUIT BOARD MANUFACTURING METHOD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to improve reliability by reinforcing adhesive power of a micro circuit for processing a plasma process. CONSTITUTION: A photoresist layer is formed on a metal seed layer(120) which is formed on an insulating substrate(110). A part of the metal seed layer is exposed by performing a photolithography process. An exposed part of the metal seed layer is processed by the plasma process. A circuit pattern(140) is formed by plating the exposed part of the metal seed layer. A photoresist layer(130) is removed therefrom.