PURPOSE: A lead frame for an LED package is provided to prevent an interface separation phenomenon due to the weak adhesion between metal and a package encapsulating member. CONSTITUTION: A pair of electrode plates supply power to an LED chip(5). The LED chip is directly contacted with a recess(31) of a chip bonding unit(30). A reflector reflects light from the LED chip. A wing unit(35) discharges heat from the LED chip to the outside. A circular protrusion(33) is formed between the wing unit and the recess.
