| 摘要 |
PURPOSE: A three dimensional interconnection structure and a manufacturing method thereof are provided to minimize optical or electric leakage by arranging a transceiver on both sides of a platform. CONSTITUTION: A three dimensional interconnection structure includes a wafer, a first electrode(102), and a second electrode(107). One side of the wafer has a reverse V shape. A U groove for mounting a circuit is formed on the bottom of the wafer. A first electrode is formed on the reverse V shaped side and the U groove of the wafer. A second electrode is formed on the reverse V shaped side and upper side of the wafer. |
