PURPOSE: A method for manufacturing an LED package is provided to improve the quality and durability of the LED package by maximizing heat dissipation performance using aluminum materials. CONSTITUTION: A substrate made of aluminum is prepared(S1). A terminal hole passing through the top and bottom of the substrate is formed(S2). An oxidation dielectric layer is formed on the surface of the substrate and the terminal hole(S3). A terminal is inserted into the terminal hole(S4). An LED is mounted on the substrate(S5). The terminal which is protruded to the lower side of the substrate is soldered with a board(S6).
