METHOD AND STRUCTURE FOR ADHESION OF INTERMETALLIC COMPOUND (IMC) ON CU PILLAR BUMP

摘要

PURPOSE: A method and a structure for bonding inter-metallic compound on a copper filler-based bump are provided to constantly maintain a gap between a die and a substrate using pillar shaped bumps. CONSTITUTION: A copper-containing filler layer(108) is formed. A diffusion barrier(110) is formed on the copper-containing filler layer. A copper-containing cap layer(112) is formed on the diffusion barrier. A solder layer(114) is formed on the copper-containing cap layer. The copper-containing cap layer and the solder layer are thermally processed in order to form inter-metallic compound.