Retaining device, especially for fixing a semiconductor wafer in a plasma etching device, and method for supply heat to or discharging heat from a substrate

摘要

Holder comprises a clamping element (11) arranged on a substrate electrode (19); and a load body (10) arranged on the substrate electrode to press onto the substrate electrode. The body is connected via a clamping unit (22,23,24) to a base body (17) supporting the substrate electrode. The load body and the base body are electrically insulated from the substrate electrode. An independent claim is also included for a process for introducing and removing heat from the rear side of a substrate held in a vacuum chamber. Preferred Features: The holder is in the form of a holding plate and has a dielectric such as Al2O3, a ferroelectric or a piezoelectric such as lead zirconate titanate ceramic which is electrically insulated from the substrate.