发明名称 APPARATUS FOR WAFER TRANSFER
摘要 PURPOSE: An apparatus for transferring wafers is provided to reduce a deposition disturbing area by minimizing the contact of a wafer support and a supporting frame. CONSTITUTION: A supporting frame(320) is fixed to a wafer transferring body part(310). A wafer support(330) is in connection with the supporting frame to support a wafer(301). The wafer support is composed of a fixing unit and a wafer support unit supporting the wafer. The fixing unit is fixed to the supporting frame using a screw. The wafer supporting unit is bent into a V-shape in order to minimize the contact area of the wafer and the wafer supporting unit.
申请公布号 KR20110002680(A) 申请公布日期 2011.01.10
申请号 KR20090060267 申请日期 2009.07.02
申请人 HYUNDAI HEAVY INDUSTRIES CO., LTD. 发明人 LEE, JIN WON
分类号 H01L21/673;B65D85/38;B65G49/07;H01L21/683 主分类号 H01L21/673
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