发明名称 |
APPARATUS FOR WAFER TRANSFER |
摘要 |
PURPOSE: An apparatus for transferring wafers is provided to reduce a deposition disturbing area by minimizing the contact of a wafer support and a supporting frame. CONSTITUTION: A supporting frame(320) is fixed to a wafer transferring body part(310). A wafer support(330) is in connection with the supporting frame to support a wafer(301). The wafer support is composed of a fixing unit and a wafer support unit supporting the wafer. The fixing unit is fixed to the supporting frame using a screw. The wafer supporting unit is bent into a V-shape in order to minimize the contact area of the wafer and the wafer supporting unit.
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申请公布号 |
KR20110002680(A) |
申请公布日期 |
2011.01.10 |
申请号 |
KR20090060267 |
申请日期 |
2009.07.02 |
申请人 |
HYUNDAI HEAVY INDUSTRIES CO., LTD. |
发明人 |
LEE, JIN WON |
分类号 |
H01L21/673;B65D85/38;B65G49/07;H01L21/683 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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