| 摘要 |
A multichip light-emitting-diode (LED) package includes a printed circuit board (PCB) having a tapered via hole and a circuit interconnection line on a surface of the PCB. An inclined surface of each via hole is used as a reflection plate reflecting light emitted by an LED chip located in the via hole. Each LED chip is directly bonded to a metal base for radiating heat. Additional heat radiation structures and reflection plates are not required, thus simplifying the structure of and manufacture of the multichip LED package, reducing manufacturing costs. |
