| 摘要 |
An electromagnetic coupling module is composed of a wireless IC chip (1) and a functional substrate (20). The electromagnetic coupling module is mounted on a radiation plate (30) using an adhesive (40). On the upper surface of a base material (31) of the radiation plate (30), two long radiation electrodes (32a, 32b) are formed. On the undersurface of the functional substrate (20), capacitive coupling electrodes (24a, 24b) that individually face inner ends of the radiation electrodes (32a, 32b) are formed. A matching circuit (23) for performing the impedance matching between the wireless IC chip (1) and each of the radiation electrodes (32a, 32b) includes the capacitive coupling electrodes (24a, 24b). As a result, it is possible to achieve the size reduction, design facilitation, and cost reduction of a wireless IC device. |
