| 摘要 |
PURPOSE: A semiconductor chip, a semiconductor device including a sealing layer, and a method for manufacturing the semiconductor device are provided to reduce the thickness of the semiconductor device by securing the sufficient intensity of the semiconductor device using a stacked structure of a sealing layer and an insulating layer. CONSTITUTION: A semiconductor structure(10) includes a semiconductor chip(11) and a plurality of electrodes(12). A sealing layer(70) seals hermetically the semiconductor chip and a post(40). A first wiring(33) is installed at one side of the sealing layer. A second wiring(83) is installed at another side of the sealing layer. A first insulating layer(30) is installed between the sealing layer and the first wiring. A second insulating layer(80) is installed between the sealing layer and the second wiring. |
