发明名称 Method for fabricating a field effect transistor having a dual thickness gate electrode
摘要 A field effect transistor and a method of fabricating the field effect transistor. The field effect transistor includes: a silicon body, a perimeter of the silicon body abutting a dielectric isolation; a source and a drain formed in the body and on opposite sides of a channel formed in the body; and a gate dielectric layer between the body and an electrically conductive gate electrode, a bottom surface of the gate dielectric layer in direct physical contact with a top surface of the body and a bottom surface the gate electrode in direct physical contact with a top surface of the gate dielectric layer, the gate electrode having a first region having a first thickness and a second region having a second thickness, the first region extending along the top surface of the gate dielectric layer over the channel region, the second thickness greater than the first thickness.
申请公布号 US7851315(B2) 申请公布日期 2010.12.14
申请号 US20080037113 申请日期 2008.02.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ANDERSON BRENT ALAN;BRYANT ANDRES;CLARK, JR. WILLIAM F.;NOWAK EDWARD JOSEPH
分类号 H01L21/336 主分类号 H01L21/336
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