LASER LIFT OFF METHOD

摘要

PURPOSE: A laser lift off method is provided to prevent the crack or breakage of a first substrate which is separated from a substrate by distributing a region which is separated from an epi layers to the whole area of the first substrate. CONSTITUTION: A first scan line is formed on a first substrate. A second scan line is formed by projecting a laser beam from a region far off the first scan line. A third scan line(L3) is formed at a region far off the second line. A fourth scan line(L4) is formed by projecting the laser beam between the first and second scan lines. A fifth scan line(L5) is formed by projecting the laser beam to the second and third scan lines. A sixth scan line is formed to be contacted with the outside of the third scan line.