发明名称 |
Polishing device and substrate processing device |
摘要 |
A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions. |
申请公布号 |
US7850817(B2) |
申请公布日期 |
2010.12.14 |
申请号 |
US20040481001 |
申请日期 |
2004.08.09 |
申请人 |
EBARA CORPORATION |
发明人 |
WAKABAYASHI SATOSHI;TOGAWA TETSUJI;KOSUGE RYUICHI;ATO KOJI;SOTOZAKI HIROSHI |
分类号 |
B24B37/04;C23F1/00;H01L21/00;H01L21/304;H01L21/677;H01L21/68;H01L21/687 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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