发明名称 Method for forming pattern in semiconductor device
摘要 A method for forming a pattern in a semiconductor device includes forming an etch target layer comprising metal over a substrate. A hard mask pattern is formed over the etch target layer. The etch target layer is etched to form a pattern such that a line width of the etch target layer is smaller than a line width of the hard mask pattern.
申请公布号 US7851364(B2) 申请公布日期 2010.12.14
申请号 US20070739647 申请日期 2007.04.24
申请人 HYNIX SEMICONDUCTOR INC. 发明人 NAM KI-WON;KIM TAE-HAN
分类号 H01L21/311 主分类号 H01L21/311
代理机构 代理人
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